TEHRAN (ANA)- An Iranian nanotechnology company developed a physical vapor deposition (PVD) system which makes possible settlement of different materials with a variety of thicknesses on different substrates in a single or stacking form.
‘Sevin Plasma Surface Engineering’ company has made the product which can, for instance, deposit a sequence of multiple layers of TIN/TIAIN, with desired interfacial adhesion and high crack propagation resistance.
This system can deposit TiN and TIAIN in a z-stacking form with a nanometric thickness. Such a multilayer coating leads to good interfacial adhesion between deposited layers, desired adhesion to the underlying substrate, high abrasion resistance and hardness, and lower crack nucleation possibility due to lower residual stress.
The PVD product can be used for deposition of different materials on different substrates based on customer's demand, R&D for designing or selecting best coating and surface treatment for different operational conditions, R&D for the evaluation and characterization of nanostructured hard coatings and layers, deposition of hard coatings on tools (such as TIN, TIAIN. CrAIN and TiAISIN), coating of different instruments and parts in automobile industry (such as TIC, DLC, and CrNi) and offering the professional training to companies and industries in the surface engineering field.
Physical vapour deposition (PVD) is a process used to produce a metal vapour that can be deposited on electrically conductive materials as a thin, highly adhered pure metal or alloy coating.
The process is carried out in a vacuum chamber at high vacuum (10–6 torr) using a cathodic arc source.
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Source: ANA